Sunday 8 December 2019

GEIA-STD-0005-1 FREE DOWNLOAD

New, more stable PWB materials have been developed to reduce some of these effects but in turn have introduced the risk of pads tearing from the PWB, known as pad cratering, illustrated in Figure 1. The cause of whiskers is not entirely understood but is believed to be related to compressive stresses in the plating. Curtiss-Wright Controls Embedded Computing CWCEC has adopted a proactive approach, having already amassed much test data, introduced new materials and test regimes such as Interconnect Stress Testing IST , and developed the full manufacturing and life-cycle capability to introduce lead-free assemblies. However, the preparation of a standard or plan does not necessarily impose the use of lead-free electronics. A leading contender for lead-free solder is SAC Ag — silver 3. geia-std-0005-1

Uploader: Malazahn
Date Added: 23 January 2014
File Size: 33.79 Mb
Operating Systems: Windows NT/2000/XP/2003/2003/7/8/10 MacOS 10/X
Downloads: 6834
Price: Free* [*Free Regsitration Required]





The presentation reviews quality assurance requirements traceability and LFCP template instructions. A leading contender for lead-free solder is SAC Ag — silver 3.

geia-std-0005-1

However, the most effective mitigations for tin whiskers include design rules that reduce the risk of shorts between solder pads, in addition to some types of conformal coatings that counter whisker growth. But, as lead-free technology is introduced, geia-xtd-0005-1 will require much additional test and qualification data to support its use in deployable projects.

Instead, it demonstrates an understanding of the impact of the component and materials supply situation in order to mitigate risks.

National Technical Reports Library

Suppliers of COTS embedded computing equipment are planning to introduce lead-free assemblies for military applications. Its microstructure is less homogeneous, causing its properties to be more orientation dependent.

Using lead-free solder is the most obvious change, and it has a number of secondary effects on reliability. Stiffer lead-free solders and more brittle PWB materials are leading to an increased risk of pad cratering on lead-free boards.

This is because of lingering doubts about the critical long-term reliability of lead-free electronics in the more highly stressed temperature geia-std0005-1 mechanical environments of many military applications.

Preparing for lead-free electronics - Military Embedded Systems

The Plan documents the Plan Owner's supplier's processes, that assure their customer, and all other stakeholders that the Plan owner's products will continue to meet their requirements. National Technical Reports Library.

geia-std-0005-1

The cross-section photo shows pad cratering on a lead-free solder joint. However, the preparation of a standard or plan does not necessarily impose the use of lead-free electronics. Advertisement [ x ]. New, more stable PWB materials have been developed to reduce some of these effects but in turn have introduced the risk of pads tearing from the PWB, known as pad cratering, illustrated in Figure 1.

Curtiss-Wright Controls Embedded Computing CWCEC has adopted a proactive approach, having already amassed much test data, introduced new materials and test regimes such as Interconnect Stress Testing ISTand developed the full manufacturing and life-cycle capability to introduce lead-free assemblies.

GEIA-STD defines the objectives of, and requirements for, documenting processes that assure customers and regulatory agencies that AHP electronic systems containing lead-free solder, piece parts, and boards will satisfy the applicable requirements for performance, reliability, airworthiness, safety, and certify-ability throughout the specified life of performance.

GEIA-STD – Offer Engineering And Technical Codes

National Aeronautics and Space Administration. As a result of the worldwide lead-free initiatives, future military contracts will require lead-free project plans. Page Count 14 Abstract GEIA-STD defines the objectives of, and requirements for, documenting processes that assure customers and regulatory agencies geua-std-0005-1 AHP electronic systems containing lead-free solder, piece parts, and boards will satisfy the applicable requirements for performance, reliability, airworthiness, safety, and certify-ability throughout the specified life of performance.

Across industry, the most significant change has been the rapid adoption of lead-free solder. The cause of whiskers is not entirely understood but is believed to be related to compressive stresses in the plating.

geia-std-0005-1

Click graphic to zoom by 1. Lead-free solder Using lead-free solder is the most obvious change, and it has a number of secondary effects on geix-std-0005-1. Military and aerospace equipment vendors, integrators, and end users are still apprehensive about using lead-free materials.

GEIA-STD-0005-1

Its higher melting point exacerbates manufacturing and rework stresses in components and the Printing Wiring Board PWB. Tin whiskers is a phenomenon whereby thin conductive filaments grow from the surface of a tin-plated termination that can potentially short-circuit adjacent pins of devices. Your session has time out.

No comments:

Post a Comment